《数字逻辑设计实践》课程教学资源（文献资料）Understanding and Interpreting Standard-Logic Data Sheets

i TEXASApplicationReportINSTRUMENTSSZZA036B-May2003Understandingand InterpretingStandard-LogicDataSheetsStephen M.Nolan and Jose M.SolteroStandard Linear &LogicABSTRACTTexas Instruments(TI)standard-logic products data sheets includedescriptionsoffunctionality and electrical specifications for the devices.Each specification includesacronyms,numerical limits,andtest conditions thatmaybeforeign to theuser.Theproperunderstanding and interpretation of the direct, and sometimes implied, meanings of thesespecifications is essential to correct product selection and associated circuit design.Thisapplicationreportexplainseachdata-sheetparameterindetail,howitaffectsthedevice,and,more important, how it impacts the application.This will enable component andsystem-design engineerstoderivethemaximumbenefitfromTi logicdevices.Contents6Introduction6Top-Level Look at the TI LogicData SheetSummaryDeviceDescription9AbsoluteMaximumRatings9RecommendedOperatingConditionsElectrical Characteristics1011Live-lnsertion Specifications12TimingRequirements12Switching Characteristics13NoiseCharacteristics14Operating Characteristics14ParameterMeasurementInformationDissecting the TI Logic Data Sheet1616SummaryDeviceDescription.16Title,LiteratureNumber,andDatesofOriginationandRevision.22Features Bullets..23PackageOptionsandPinouts23Description23BGAPackagingTop-ViewIllustrationsandPin-AssignmentsTable23OrderingInformation24FunctionTable26LogicDiagram27ProductDevelopmentStageNote27AbsoluteMaximumRatings27SupplyVoltage,Vcc.Trademarksarethepropertyoftheirrespectiveowners

Application Report SZZA036B - May 2003 1 Understanding and Interpreting Standard-Logic Data Sheets Stephen M. Nolan and Jose M. Soltero Standard Linear & Logic ABSTRACT Texas Instruments (TI) standard-logic products data sheets include descriptions of functionality and electrical specifications for the devices. Each specification includes acronyms, numerical limits, and test conditions that may be foreign to the user. The proper understanding and interpretation of the direct, and sometimes implied, meanings of these specifications is essential to correct product selection and associated circuit design. This application report explains each data-sheet parameter in detail, how it affects the device, and, more important, how it impacts the application. This will enable component and system-design engineers to derive the maximum benefit from TI logic devices. Contents Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Top-Level Look at the TI Logic Data Sheet 6 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Summary Device Description 7 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Absolute Maximum Ratings 9 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Recommended Operating Conditions 9 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Electrical Characteristics 10 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Live-Insertion Specifications 11 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Timing Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Switching Characteristics 12 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Noise Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Operating Characteristics 14 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Parameter Measurement Information 14 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Dissecting the TI Logic Data Sheet 16 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Summary Device Description 16 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Title, Literature Number, and Dates of Origination and Revision 16 . . . . . . . . . . . . . . . . . . . . . . . . Features Bullets . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 Package Options and Pinouts 23 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 BGA Packaging Top-View Illustrations and Pin-Assignments Table 23 . . . . . . . . . . . . . . . . . . . . . Ordering Information 23 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Function Table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 Logic Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 Product Development Stage Note 27 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Absolute Maximum Ratings 27 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Supply Voltage, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 Trademarks are the property of their respective owners

福TEXASINSTRUMENTSSZZA036B27InputVoltageV28Output Voltage,Vo.28VoltageRangeAppliedtoAnyOutput in theHigh-lmpedanceorPower-Off State,Vo29VoltageRangeApplied toAnyOutput intheHighState,Vo29Input Clamp Current, lk29Output Clamp Current, lok29Continuous Output Current, l29ContinuousCurrentThroughVccorGNDTerminals29PackageThermalImpedance, Junction-to-Ambient,JA30Storage Temperature Range, Tstg30Recommended Operating Conditions30VccSupplyVoltage.30BIASVccBiasSupplyVoltage30VTTTermination Voltage31Vref Reference Voltage31ViH High-Level Input Voltage32ViL Low-level Input Voltage33loH High-Level Output Current33loHs Static High-Level Output Current33loL Low-Level OutputCurrent34loLs Static Low-Level Output Current34V, Input Voltage35VoOutput Voltage35At/AvInputTransitionRiseorFall Rate36At/△VccPower-UpRampRate36TAOperatingFree-AirTemperature39ElectricalCharacteristics39VT+ Positive-Going Input Threshold Level.39VT-Negative-Going Input Threshold Level40VT Hysteresis (VT+-VT-).42VikInput ClampVoltage.43VoH High-Level Output Voltage.43VoHs Static High-Level Output Voltage.43VoL Low-Level Output Voltage.44VoLs Static Low-Level Output Voltage.44FonOn-StateResistance.44I Input Current.45liH High-Level Input Current.45liL Low-Level Input Current.45Ili(hold) Input Holid Current ..46IBHH Bus-Hold High Sustaining Current47IBHL Bus-Hold Low Sustaining Current47IBHHo Bus-Hold High Overdrive Current.47IBHLOBus-Hold LowOverdrive Current.47loff Input/OutputPower-Off LeakageCurrent49lozOff-State (High-ImpedanceState)OutputCurrent (ofa3-StateOutput)49lozH Off-State Output Current With High-Level Voltage Applied50lozLOff-StateOutputCurrent WithLow-LevelVoltageApplied2Understanding and Interpreting Standard-Logic Data Sheets

SZZA036B 2 Understanding and Interpreting Standard-Logic Data Sheets Input Voltage, VI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 Output Voltage, VO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 Voltage Range Applied to Any Output in the High-Impedance or Power-Off State, VO . . . . 28 Voltage Range Applied to Any Output in the High State, VO . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 Input Clamp Current, IIK . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 Output Clamp Current, IOK . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 Continuous Output Current, IO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 Continuous Current Through VCC or GND Terminals 29 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Package Thermal Impedance, Junction-to-Ambient, θJA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 Storage Temperature Range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 Recommended Operating Conditions 30 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VCC Supply Voltage 30 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . BIAS VCC Bias Supply Voltage 30 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VTT Termination Voltage 30 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Vref Reference Voltage 31 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VIH High-Level Input Voltage 31 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VIL Low-level Input Voltage 32 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . IOH High-Level Output Current 33 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . IOHS Static High-Level Output Current 33 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . IOL Low-Level Output Current 33 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . IOLS Static Low-Level Output Current 34 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VI Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34 VO Output Voltage 35 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ∆t/∆v Input Transition Rise or Fall Rate 35 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ∆t/∆VCC Power-Up Ramp Rate 36 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . TA Operating Free-Air Temperature 36 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Electrical Characteristics 39 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VT+ Positive-Going Input Threshold Level 39 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VT– Negative-Going Input Threshold Level 39 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ∆VT Hysteresis (VT+ – VT–) 40 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VIK Input Clamp Voltage 42 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VOH High-Level Output Voltage 43 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VOHS Static High-Level Output Voltage 43 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VOL Low-Level Output Voltage 43 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VOLS Static Low-Level Output Voltage 44 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ron On-State Resistance 44 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . II Input Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44 IIH High-Level Input Current 45 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . IIL Low-Level Input Current 45 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . II(hold) Input Hold Current 45 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . IBHH Bus-Hold High Sustaining Current 46 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . IBHL Bus-Hold Low Sustaining Current 47 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . IBHHO Bus-Hold High Overdrive Current 47 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . IBHLO Bus-Hold Low Overdrive Current 47 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Ioff Input/Output Power-Off Leakage Current 47 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . IOZ Off-State (High-Impedance State) Output Current (of a 3-State Output) 49 . . . . . . . . . . . . . IOZH Off-State Output Current With High-Level Voltage Applied 49 . . . . . . . . . . . . . . . . . . . . . . . IOZL Off-State Output Current With Low-Level Voltage Applied 50 . . . . . . . . . . . . . . . . . . . . . . .

福EXASINSTRUMENTSSZZA036BlozPDPower-DownOff-State(High-ImpedanceState)50OutputCurrent (ofa3-StateOutput).51lozPu Power-Up Off-State (High-Impedance State) Output Current (of a 3-State Output)51IcExOutput HighLeakageCurrent51Icc Supply Current52AlccSupply-CurrentChange..53C,Input Capacitance..53CioInput/OutputCapacitance..53CoOutputCapacitance.53Live-Insertion Specifications53Icc(BIAsVcc)BIASVccCurrent53VoOutputBias Voltage54loOutputBiasCurrent54TimingRequirements54fclock Clock Frequency54tw Pulse Duration (Width)55tsu Setup Time55th Hold Time56SwitchingCharacteristics56fmax Maximum Clock Frequency57tpd Propagation Delay Time58tpHLPropagation Delay Time,High-Level to Low-Level Output58tpLHPropagation Delay Time, Low-Level toHigh-Level Output58tenEnableTime(ofa3-StateorOpen-CollectorOutput)59tpzHEnableTime(ofa3-StateOutput)toHigh Level59tpzLEnableTime(ofa3-stateOutput)toLow Level59tdis DisableTime (ofa3-State orOpen-CollectorOutput)60tpHz DisableTime (of a 3-State Output)From High Level60tpLz DisableTime (of a 3-StateOutput)FromLow Level .60tf Fall Time..60t, Rise Time ...60SlewRate..60tsk(i) Input Skew..61tsk(i) Limit Skew61tsk(o) Output Skew61tsk(p) Pulse Skew61tsk(pr) Process Skew62Noise Characteristics62VoL(P) Quiet Output, Maximum Dynamic VoL62VoL( Quiet Output, Minimum Dynamic VoL63VoH(P) Quiet Output, Maximum Dynamic VoH63VoH(MQuietOutput,MinimumDynamic VoH63VIH(D)High-Level Dynamic Input Voltage63ViL(D)Low-LevelDynamicInputVoltage64OperatingCharacteristics64CpdPower-DissipationCapacitance.64ParameterMeasurementInformation.64Logic Compatibility.66Conclusion3Understanding and Interpreting Standard-Logic Data Sheets

SZZA036B Understanding and Interpreting Standard-Logic Data Sheets 3 IOZPD Power-Down Off-State (High-Impedance State) Output Current (of a 3-State Output) 50 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . IOZPU Power-Up Off-State (High-Impedance State) Output Current (of a 3-State Output) 51 . ICEX Output High Leakage Current 51 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ICC Supply Current 51 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ∆ICC Supply-Current Change 52 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Ci Input Capacitance 53 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Cio Input/Output Capacitance 53 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Co Output Capacitance 53 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Live-Insertion Specifications 53 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ICC (BIAS VCC) BIAS VCC Current 53 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VO Output Bias Voltage 53 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . IO Output Bias Current 54 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Timing Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54 fclock Clock Frequency 54 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . tw Pulse Duration (Width) 54 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . tsu Setup Time . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55 th Hold Time . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55 Switching Characteristics 56 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . fmax Maximum Clock Frequency 56 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . tpd Propagation Delay Time 57 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . tPHL Propagation Delay Time, High-Level to Low-Level Output 58 . . . . . . . . . . . . . . . . . . . . . . . . tPLH Propagation Delay Time, Low-Level to High-Level Output 58 . . . . . . . . . . . . . . . . . . . . . . . . ten Enable Time (of a 3-State or Open-Collector Output) 58 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . tPZH Enable Time (of a 3-State Output) to High Level 59 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . tPZL Enable Time (of a 3-state Output) to Low Level 59 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . tdis Disable Time (of a 3-State or Open-Collector Output) 59 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . tPHZ Disable Time (of a 3-State Output) From High Level 60 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . tPLZ Disable Time (of a 3-State Output) From Low Level 60 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . tf Fall Time . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60 tr Rise Time . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60 Slew Rate . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60 tsk(i) Input Skew . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60 tsk(l) Limit Skew . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61 tsk(o) Output Skew 61 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . tsk(p) Pulse Skew . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61 tsk(pr) Process Skew 61 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Noise Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62 VOL(P) Quiet Output, Maximum Dynamic VOL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62 VOL(V) Quiet Output, Minimum Dynamic VOL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62 VOH(P) Quiet Output, Maximum Dynamic VOH . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63 VOH(V) Quiet Output, Minimum Dynamic VOH . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63 VIH(D) High-Level Dynamic Input Voltage 63 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VIL(D) Low-Level Dynamic Input Voltage 63 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Operating Characteristics 64 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Cpd Power-Dissipation Capacitance 64 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Parameter Measurement Information 64 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Logic Compatibility . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64 Conclusion . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66

iMEXASINSTRUMENTSSZZA036B.66Acknowledgments66ReferencesList of Figures.81.ExampleofSummaryDeviceDescription.92.ExampleofAbsoluteMaximumRatingsSection.:103.ExampleRecommendedOperatingConditionsSection..114.ExampleElectrical-CharacteristicsSection·125.ExampleLive-lnsertionSection...126.ExampleTiming-RequirementsSection.137.Example of Switching-Characteristics Section...138.ExampleNoise-Characteristics Section.149.ExampleofOperating-CharacteristicsSection.1510.ExampleParameterMeasurementInformationSection.1711.Device NumberandPackageDesignators for TIDevices.1812.ExampleofConfigurableVccDevices.1913.CBTvsCBTDWithInternalDiode.1914.Benefit of UsingBus-HoldDevices..2015.Series-Damping-ResistorOption...2016.SchottkyClamping-DiodeDeviceSchematic..2117.Undershoot-ProtectionCircuitryinK-OptionDevices.2218.PU3SCircuitImplementation.2619.ExampleLogicDiagrams.2820.RepresentationofTypical LogicI/OClampingCircuits21.High-K Thermal-Resistance Graphs for 5-,14-,16-,20-,24-,48-,56-,64-,.37and80-PinPackages.4022. Hysteresis: Vi vs Vo.4123.Hysteresis:Input VoltagevsTime.4224.PossibleOutput-VoltageOutcomeforDevicesWithoutHysteresis..4225.Glitch-RejectionCapabilitiesofDeviceswithHysteresis..4626. Bus-Hold Currents.4827.Typical CMOSTotem-PoleOutput With loff..4928.Typical CMOS Input With Bus-Hold and loff...5129.TILogicDeviceI/OTextforloZPUand loZPD...5230. Example Typical AC and AHC IcC vs Input Voltage.5531.PulseDuration.5632.SetupandHoldTimes. 6233.Output Noise Characteristics.6534.LogicCompatibilityBetweenI/Os4Understanding and Interpreting Standard-Logic Data Sheets

SZZA036B 4 Understanding and Interpreting Standard-Logic Data Sheets Acknowledgments . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66 References . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66 List of Figures 1. Example of Summary Device Description 8 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2. Example of Absolute Maximum Ratings Section 9 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3. Example Recommended Operating Conditions Section 10 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4. Example Electrical-Characteristics Section 11 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5. Example Live-Insertion Section 12 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6. Example Timing-Requirements Section 12 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7. Example of Switching-Characteristics Section 13 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8. Example Noise-Characteristics Section 13 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9. Example of Operating-Characteristics Section 14 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10. Example Parameter Measurement Information Section 15 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11. Device Number and Package Designators for TI Devices 17 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12. Example of Configurable VCC Devices 18 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13. CBT vs CBTD With Internal Diode 19 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14. Benefit of Using Bus-Hold Devices 19 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15. Series-Damping-Resistor Option 20 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16. Schottky Clamping-Diode Device Schematic 20 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17. Undershoot-Protection Circuitry in K-Option Devices 21 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18. PU3S Circuit Implementation 22 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19. Example Logic Diagrams 26 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20. Representation of Typical Logic I/O Clamping Circuits 28 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21. High-K Thermal-Resistance Graphs for 5-, 14-, 16-, 20-, 24-, 48-, 56-, 64-, and 80-Pin Packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37 22. Hysteresis: VI vs VO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40 23. Hysteresis: Input Voltage vs Time 41 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24. Possible Output-Voltage Outcome for Devices Without Hysteresis 42 . . . . . . . . . . . . . . . . . . . . . . . . . . 25. Glitch-Rejection Capabilities of Devices with Hysteresis 42 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26. Bus-Hold Currents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46 27. Typical CMOS Totem-Pole Output With Ioff . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48 28. Typical CMOS Input With Bus-Hold and Ioff . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49 29. TI Logic Device I/O Text for IOZPU and IOZPD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51 30. Example Typical AC and AHC ICC vs Input Voltage 52 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31. Pulse Duration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55 32. Setup and Hold Times . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56 33. Output Noise Characteristics 62 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34. Logic Compatibility Between I/Os 65 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

iTEXASINSTRUMENTSSZZA036BListofTables231.PackageAlias252.FunctionTable.653.KeyParametersperTechnologyforLogicCompatibility5Understanding and Interpreting Standard-LogicDataSheets

SZZA036B Understanding and Interpreting Standard-Logic Data Sheets 5 List of Tables 1. Package Alias . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 2. Function Table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 3. Key Parameters per Technology for Logic Compatibility 65 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

TEXASSZZA036BINSTRUMENTSIntroductionToassistcomponentand system-design engineersin selectingTexas Instruments(TI)standard-logicproducts,this applicationreport is asynopsisof theinformationavailablefromatypical TI data sheet. Information includes a briefdescription of terms, definitions, and testingprocedures currentlyusedfor commercialandmilitaryspecifications.Symbols,terms,anddefinitionsgenerallyare inaccordancewiththosecurrentlyagreeduponbytheJEDECSolidStateTechnologyAssociationforuseintheUSAandbytheInternationalElectrotechnicalCommission (IEC)for international use.This application report is organized intofivemainsections1.Introduction2.Top-Level Look at the TI Data Sheet. Overall layout and component parts of a datasheet are explained.3.DissectingtheTILogicDataSheet.JEDECdefinition,theTIdefinition,anexplanation,and,wherepossible,helpfulhintsarepresentedforeachspecificationterm commonlyfoundin TI logic data sheets.4.Logic Compatibility.Information in TI logicdata sheets fordetermining theinterfacecompatibilitybetweendifferentlogicfamiliesisexplained.5.Endmatter,includingtheConclusion,Acknowledgments,andReferencessections.Top-LevelLookattheTlLogicDataSheetTheTI logic data sheet presentspertinenttechnical information foraparticulardeviceand isorganizedforquick access.This application reportdissects atypical Tl logicdata sheetanddescribesthe organization ofall data sheets.Typically, there are ten sections in TI logic data sheets:1.Summarydevicedescription2.Absolutemaximumratings3.Recommendedoperatingconditions4.Electrical characteristics5.Live-insertion specifications6.Timing requirements7.Switchingcharacteristics8.Noisecharacteristics9.Operatingcharacteristics10.Parametermeasurementinformation6Understanding and Interpreting Standard-LogicData Sheets

SZZA036B 6 Understanding and Interpreting Standard-Logic Data Sheets Introduction To assist component and system-design engineers in selecting Texas Instruments (TI) standard-logic products, this application report is a synopsis of the information available from a typical TI data sheet. Information includes a brief description of terms, definitions, and testing procedures currently used for commercial and military specifications. Symbols, terms, and definitions generally are in accordance with those currently agreed upon by the JEDEC Solid State Technology Association for use in the USA and by the International Electrotechnical Commission (IEC) for international use. This application report is organized into five main sections: 1. Introduction 2. Top-Level Look at the TI Data Sheet. Overall layout and component parts of a data sheet are explained. 3. Dissecting the TI Logic Data Sheet. JEDEC definition, the TI definition, an explanation, and, where possible, helpful hints are presented for each specification term commonly found in TI logic data sheets. 4. Logic Compatibility. Information in TI logic data sheets for determining the interface compatibility between different logic families is explained. 5. End matter, including the Conclusion, Acknowledgments, and References sections. Top-Level Look at the TI Logic Data Sheet The TI logic data sheet presents pertinent technical information for a particular device and is organized for quick access. This application report dissects a typical TI logic data sheet and describes the organization of all data sheets. Typically, there are ten sections in TI logic data sheets: 1. Summary device description 2. Absolute maximum ratings 3. Recommended operating conditions 4. Electrical characteristics 5. Live-insertion specifications 6. Timing requirements 7. Switching characteristics 8. Noise characteristics 9. Operating characteristics 10. Parameter measurement information

iTEXASINSTRUMENTSSZZA036BSummary DeviceDescriptionThe first section of a data sheet contains all of thegeneral information about a device (seeFigure1).Thisinformationincludes:1.Title,literaturenumber,anddatesoforiginationand revision,asapplicable2.Description of themain features andbenefits ofthedevice,alsoknownas features bullets3.FPackageoptionsandpinouts4.Description5.BGApackagingtop-view illustrationandterminalassignmentstable,ifapplicable(notillustrated in Figure 1)6.Orderinginformation7.Functiontable8.Logic diagram (positive logic)9.FProduct-development-stagenote7UnderstandingandInterpretingStandard-LogicDataSheets

SZZA036B Understanding and Interpreting Standard-Logic Data Sheets 7 Summary Device Description The first section of a data sheet contains all of the general information about a device (see Figure 1). This information includes: 1. Title, literature number, and dates of origination and revision, as applicable 2. Description of the main features and benefits of the device, also known as features bullets 3. Package options and pinouts 4. Description 5. BGA packaging top-view illustration and terminal assignments table, if applicable (not illustrated in Figure 1) 6. Ordering information 7. Function table 8. Logic diagram (positive logic) 9. Product-development-stage note

TEXASSZZA036BINSTRUMENTSSN74ALVC00QUADRUPLE2-INPUTPOSITIVE-NANDGATESCES115D-VISEDMARCH2002.Latch-UpPerformanceExceeds250mAPerD,DGV,NS,ORPW PACKAGE(TOPVIEW)JESD17ESDProtectlonExceedsJESD221Ad,14pVcc-2000-V Human-Body Model (A114-A)180213b4B200-V Machine Model (A115-A)1Y9312j4A104Y2A4description28953B10bThis quadruple 2-input positive-NAND gate is2Y693A3YGNDdesigned for1.65-Vto 3.6-V Vcc operation.The SN74ALVC00performs theBoolean functionY-A.BorY-A+Binpositive logic.ORDERINGINFORMATIONORDERABLETOP-SIDEPACKAGETTAMARKINGPARTNUMBERTubeSN74ALVCO0DSOIC-DALVC00Tape and reelSN74ALVC00DR640°C to 85°CSOPNSTape and reelSN74ALVC00NSRALVC00TSSOP-PWTape and reelSN74ALVC00PWRVA00TVSOP-DGVTape and reelSN74ALVC00DGVRVA00TPackage drawings, standard packing quantities,thermal data, symbolization, and PCB design guldlinesare available atwww.ti.com/sc/package.FUNCTIONTABLE(each gatoe) INPUTSOUTPUTYA0HHXHlogicdiagram,eachgate(positivelogic)BPleasebeawarethatanimportantnoticeconceming avallabilty,standard warranty,anduseincriticalapplicationsAATexas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.PROomabonCopyright 2002, Texas Instruments Incorporated9 TEXASafallINSTRUMENTSPOSTOFFICEBOX655303DALLAS,TEXAS75265Figure1.ExampleofSummaryDeviceDescription8Understandingand InterpretingStandard-LogicDataSheets

SZZA036B 8 Understanding and Interpreting Standard-Logic Data Sheets 1 2 3 4 6 7 8 9 Figure 1. Example of Summary Device Description

iFXASINSTRUMENTSSZZA036BAbsoluteMaximumRatingsTheabsolute maximum ratings section (Figure2)specifies the stress levelsthat, if exceeded,maycausepermanentdamagetothedevice.However,thesearestressratingsonly,andfunctionaloperationofthedeviceattheseoranyotherconditionsbeyondthoseindicatedunderrecommendedoperatingconditionsisnotimplied.Also,exposuretoabsolute-maximum-ratedconditionsforextendedperiodsmayaffectdevicereliabilityAs Figure 2 indicates,there are two absolutemaximums that may be exceeded under certainconditions.Theinputandoutputvoltageratings,ViandVo,maybeexceedediftheinputandoutput maximum clamp-currentratings, lik and lok,are observed.absolutemaximumratings overoperatingfree-airtemperaturerange (unless otherwisenoted)t0.5Vto4.6VSupply voltage range,Vcc:..0.5Vto4.6vInputvoltagerange,V,(seeNote1):0.5Vto Vcc+0.5VOutputvoltagerange,Vo(seeNotes1and2):.50mAInputclampcurrent,lik(V,<O):-50mAOutputclampcurrent,lok(Vo<0):±50mAContinuousoutputcurrent,lo:.±100mAContinuouscurrentthroughVccorGND:86°C/WPackagethermal impedance,8JA(seeNote3):Dpackage127°C/WDGVpackage76°C/WNSpackage..113C/WPWpackage65℃Cto150℃Storagetemperaturerange,TstgStressesbeyondthoselistedunder'absolutemaximumratingsmaycausepermanentdamagetothedevice.Thesearestressratingsonly.ander"recommendedoperatingconditions"isnotfunctionaloperationof thedeviceatthese orany otherconditionsbeyond those indicatedunderuretoabsolute-ratedconditionsforextendedperiodsmayaffectdevicereliabilitymplied.ExpoThe inputnegative-voltageandoutputvoltageratingsmaybeexceeded ifthe inputandoutputcurrentratings areobservedNOTES:1.Thisvalueislimitedto4.6Vmaximun3.Thepackage thermal impedance iscalculated in accordance withJESD51-7.Figure2.ExampleofAbsoluteMaximumRatingsSectionHelpful Hint:All currentsaredefined withrespectto conventional currentflow intothe respectiveterminal ofthe integrated circuit. This means that any current that flows out of the respective terminal isconsideredtobeanegativequantityAllimitsaregiven accordingtotheabsolute-magnitudeconvention,withafewexceptions.Inthis convention,maximum refers to the greater magnitude limit ofa range of like-signed values;iftherangeincludesbothpositiveandnegativevalues,bothlimitvaluesaremaximums.Minimum referstothe smallermagnitudelimit ofa rangeof like-signedvalues;iftherangeincludesbothpositiveandnegativevalues,theminimumisimplicitlyzero.ThemostcommonexceptionstotheuseoftheabsolutemagnitudeconventionaretemperatureandlogiclevelsHerezerodoesnotrepresenttheleast-possiblequantity,sothealgebraicconventioniscommonlyaccepted.Inthiscase,maximumreferstothemost-positivevalueRecommendedOperatingConditionsTherecommendedoperating conditions section of thedata sheet sets the conditions over whichTexasInstrumentsspecifiesdeviceoperation(seeFigure3).Thesearetheconditionsthattheapplicationcircuitshouldprovidetothedeviceforittofunctionasintended.Thelimitsforitemsthat appear in this section are used as test conditions for the limits that appear in the electricalcharacteristics,timingrequirements,switchingcharacteristics,andoperatingconditionssections9Understanding and Interpreting Standard-Logic Data Sheets

SZZA036B Understanding and Interpreting Standard-Logic Data Sheets 9 Absolute Maximum Ratings The absolute maximum ratings section (Figure 2) specifies the stress levels that, if exceeded, may cause permanent damage to the device. However, these are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Also, exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. As Figure 2 indicates, there are two absolute maximums that may be exceeded under certain conditions. The input and output voltage ratings, VI and VO, may be exceeded if the input and output maximum clamp-current ratings, IIK and IOK, are observed. Figure 2. Example of Absolute Maximum Ratings Section Helpful Hint: All currents are defined with respect to conventional current flow into the respective terminal of the integrated circuit. This means that any current that flows out of the respective terminal is considered to be a negative quantity. All limits are given according to the absolute-magnitude convention, with a few exceptions. In this convention, maximum refers to the greater magnitude limit of a range of like-signed values; if the range includes both positive and negative values, both limit values are maximums. Minimum refers to the smaller magnitude limit of a range of like-signed values; if the range includes both positive and negative values, the minimum is implicitly zero. The most common exceptions to the use of the absolute magnitude convention are temperature and logic levels. Here, zero does not represent the least-possible quantity, so the algebraic convention is commonly accepted. In this case, maximum refers to the most-positive value. Recommended Operating Conditions The recommended operating conditions section of the data sheet sets the conditions over which Texas Instruments specifies device operation (see Figure 3). These are the conditions that the application circuit should provide to the device for it to function as intended. The limits for items that appear in this section are used as test conditions for the limits that appear in the electrical characteristics, timing requirements, switching characteristics, and operating conditions sections

iTEXASINSTRUMENTSSZZA036Brecommendedoperatingconditions(seeNote4)SN54LVTH16646SN74LVTH16646UNITMINMINMAXMAX2.73.62.73.6VVccSupply voltage22vVIHHigh-level input voltageAvVIL0.80.8Low-level input voltageVi5.55.5vAInput voltage-24-32mALOHHigh-level output currentA4864mALoLLow-leveloutput current010A/AV10ns/VInput transition rise or fall rateOutputsenabledQ200200usVA/AVCCPower-up ramp rateTA551254085°℃Operatingfree-airtemperatureNOTE 1:All unusedcontrol inputs ofthedevice must be held at Vcc or GNDto ensure proper deviceoperation.Referto the Tlapplication report,ImplicationsofSloworFloatingCMOSInputs,literaturenumberSCBA004.Figure3.ExampleRecommendedOperatingConditionsSectionElectricalCharacteristicsThe electrical characteristics over recommended free-air temperature range table, also known intheindustryasthedctable,providesthespecifiedelectrical-characteristiclimitsofthedevicewhen tested underthe conditions in therecommendedoperating conditionstable,as givenspecificallyforeachparameter(seeFigure4)Helpful Hint:Althoughsomeparameters,suchasC,andCio,canbetestedwithanacsignal,sometimestheelectricalcharacteristicstableiscalledthedcsection.10UnderstandingandInterpretingStandard-LogicDataSheets

SZZA036B 10 Understanding and Interpreting Standard-Logic Data Sheets recommended operating conditions (see Note 4) SN54LVTH16646 SN74LVTH16646 UNIT MIN MAX MIN MAX VCC Supply voltage 2.7 3.6 2.7 3.6 V VIH High-level input voltage 2 2 V VIL Low-level input voltage 0.8 0.8 V VI Input voltage 5.5 5.5 V IOH High-level output current –24 –32 mA IOL Low-level output current 48 64 mA ∆t/∆v Input transition rise or fall rate Outputs enabled 10 10 ns/V ∆t/∆VCC Power-up ramp rate 200 200 µs/V TA Operating free-air temperature –55 125 –40 85 °C NOTE 1: All unused control inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004. Figure 3. Example Recommended Operating Conditions Section Electrical Characteristics The electrical characteristics over recommended free-air temperature range table, also known in the industry as the dc table, provides the specified electrical-characteristic limits of the device when tested under the conditions in the recommended operating conditions table, as given specifically for each parameter (see Figure 4). Helpful Hint: Although some parameters, such as Ci and Cio, can be tested with an ac signal, sometimes the electrical characteristics table is called the dc section