《材料测试技术及方法》课程教学资源（书籍文献）Encyclopedia of Materials Characterization，PDF电子书，C. Richard Brundle，Surfaces, Interfaces, Thin Films

ENCYCLOPEDIA OF MATERIALS CHARACTERIZATION C.Richard Brundle Charles A.Evans,Ir Shaun Wilson MATERIALS CHARACTERIZATION SERIES SURFACES,INTERFACES.THIN FILMS

ENCYCLOPEDIA OF MATERIALS CHARACTERIZATION C. Richard Brundle Charles A. Evans, Jr. Shaun Wilson a MAT E R I A LS CHARACTER SERIES SURFACES, INTERFACES, THIN FILMS +

This bookwasacquired.developed,and produced by Manning Publications Co. Copyright1992 by Butterworth-Heinemann,a division of Reed Publishing (USA)Ine. All rights reserved. No part of this publicaion may be reproduced,d ineiayeoramied, aphotocopyingor otherwise, en pern id-free papet,andebthated. 2bfmahhanceaioeha,aiehcatinlnvcRhrdBnandk,CrthAgn Techno gy)Testing.1.Evans.CharlesA.II.Wilson,Shaun.III.Title.IV.Series Stoncham,MA02180 ich.CT06830 109876543 Printed in the United States of America

This book was acquired, developed, and produced by Manning Publications Co. Copyright Q 1992 by Butxetworch-Heinemann, a division of Reed Publishing CUSA) Inc Au rights rad No parc of this publicarion may be reproduced, scored in a retried system, or transmitted, in any form or by means. electronic, mechanical, photocopying, or orherwise, without prior written permission of the publisher. Recognizing the importance of preserving what has been written, it is the policy of Butterworth-Heinemann and of Manning to have the books they publish printed on acid-free paper, and we exert our best &m to that end. Library of Congress Cataloging-in-Publication Data Brundle, C. R. Encyclopedia of materials characterization: surfaces, interfaces, thin films/C. Richard Brundle, Charles A. Evans, Jr., Sham Wilson. p. un.-(Materials characterization series) Indudes bibliographical refrrenoa and index. ISBN CL7506-9168-9 1. Surfaces (Tedmoology)-Tes~ I. Evans, Charlak 11. Wilson, Shaun. 111. Title. IV. Series. TA418.7.B73 I992 92-14999 620’.4Pdc20 CIP Butterworth-Heinemann 80 Montvale Avenue Stoneham, MA02180 Manning Publications Co. 3 his Street Greenwich, CT 06830 109 8 7 6 5 4 3 Printed in the Unired States ofAmerica

Contents Preface to Series ix Preface x Acronyms Glossary xi Contributors xvi INTRODUCTION AND SUMMARIES 1.0 Introduction I Technique Summaries 7-56 IMAGING TECHNIQUES (MICROSCOPY) 2.0 Introduction 57 2.1 Light Microscopy 60 22 Scanning Electron Microscopy,SEM 7 2.3 Scanning Tunneling Microscopy and Scanning Force Microscopy,STM and SFM 8s 2.4 Transmission Electron Microscopy.TEM99 ELECTRON BEAM INSTRUMENTS 3.0 Introduction 117 3.1 Energy-Dispersive X-Ray Spectroscopy,EDS 120 3.2 Electron Energy-Loss Spectroscopy in the Transmission Electron ope.EELS 135 3.3 Cathodoluminescence,CL 149 3.4 Scanning Transmission Electron Microscopy,STEM 161 3.5 Electron Probe X-Ray Microanalysis,EPMA 175

Contents Preface to Series ix Preface x Acronyms Glossary xi Contributors xvi INTRODUCTION AND SUMMARIES 1.0 Introduction I Technique Summaries 7-56 IMAGING TECHNIQUES (MICROSCOPY) 2.0 Introduction 57 2.1 Light Microscopy 60 2.2 Scanning Electron Microscopy, SEM 70 2.3 Scanning Tunneling Microscopy and 2.4 Transmission Electron Microscopy, TEM 99 Scanning Force Microscopy, STM and SFM 85 ELECTRON BEAM INSTRUMENTS 3.0 Introduction 117 3.1 Energy-Dispersive X-Ray Spectroscopy, EDS 120 3.2 Electron Energy-Loss Spectroscopy in the Transmission Electron Microscope, EELS 135 3.3 Cathodoluminescence, CL 149 3.4 Scanning Transmission Electron Microscopy, STEM 161 3.5 Electron Probe X-Ray Microanalysis, EPMA 175 V

STRUCTURE DETERMINATION BY DIFFRACTION AND SCATTERING 4.0 Introduction 193 4.1 X-Ray Diffraction, XRD 198 4.2 Extended X-Ray Absorption Fine Structure,EXAFS 214 43 Surface Extended X-Ray Absorption Fine Structure and Near Edge X-Ray Absorption Fine Strucrure,SEXAFS/NEXAFS 227 4.4 X-Ray Photoelectron and Auger Electron Diffraction,XPD and AED 240 4.5 Low-Energy Electron Diffraction,LEED 252 4.6 Reflection High-Energy Electron Diffraction,RHEED 264 ELECTRON EMISSION SPECTROSCOPIES 5.0 Introduction 279 X-Ray Photoelectron Spectroscopy,XPS 282 62 Ultraviolet Photoelectron Spectroscopy,UPS3 5.3 Auger Electron Spectroscopy,AES 3I0 5.4 Reflected Electron Energy-loss Spectroscopy, REELS 324 X-RAY EMISSION TECHNIQUES 6.0 Introduction 335 6.1 X-Ray Fluorescence.XRF 338 62 Total Reflection X-Ray Fluorescence Analysis,TXRF 349 6.3 Particle-Induced X-Ray Emission,PIXE 357 VISIBLE/UV EMISSION,REFLECTION,AND ABSORPTION 7.0 Introduction 37 7.1 Photoluminescence,PL 373 12 Modulation Spectroscopy 385 3 Variable Angle Spectroscopic Ellipsometry,VASE 401 VIBRATIONAL SPECTROSCOPIES AND NMR 8.0 Introduction 413 8.1 Fourier Transform Infrared Spectroscopy,FTIR 416 8.2 Raman Spectroscopy 428 8.3 High-Resolution Electron Energy Loss Spectroscopy,HREELS 442 8.4 Solid State Nucear Magnetic Resonance,NMR ，46o vi Contents

STRUCTURE DETERMINATION BY DIFFRACTION AND SCATTERING 4.0 Introduction 193 4.1 X-Ray Diffraction, XRD 198 4.2 Extended X-Ray Absorption Fine Structure, EXAFS 214 4.3 Su&ce Extended X-Ray Absorption Fine Structure and Near Edge X-Ray Absorption Fine Structure, SEXAFS/NEXAFS Auger Electron Difiction, XPD and AED 227 4.4 X-Ray Photoelectron and 4.5 Low-Energy Electron Diffraction, LEED 252 4.6 Reflection High-Energy Electron Diffraction, WEED 264 240 ELECTRON EMISSION SPECTROSCOPIES 5.0 Introduction 279 5.1 X-Ray Photoelectron Spectroscopy, XPS 282 5.2 Ultraviolet Photoelectron Spectroscopy, UPS 300 5.3 Auger Electron Spectroscopy, AES 310 5.4 Reflected Electron Energy-loss Spectroscopy, REELS 324 X-RAY EMISION TECHNIQUES 6.0 Introduction 335 6.1 X-Ray Fluorescence, XRF 338 6.2 Total Reflection X-Ray Fluorescence Analysis, TXRF 349 6.3 Particle-Induced X-Ray Emission, PIXE 357 VISIBLE/W EMISSION, REFLECTION, AND ABSORPTION 7.0 Introduction 371 7.1 Photoluminescence, PL 373 7.2 Modulation Spectroscopy 385 7.3 Variable Angle Spectroscopic Ellipsometry, VASE 401 VIBRATIONAL SPECTROSCOPIES AND NMR 8.0 Introduction 413 8.1 Fourier Transform Infrared Spectroscopy, FTIR 416 8.2 RamanSpectroscopy 428 8.3 High-Resolution Electron Energy Loss Spectroscopy, HREELS 4-42 8.4 Solid State Nuclear Magnetic Resonance, NMR 460 vi Contents

ION SCATTERING TECHNIQUES 9.0 Introduction 473 91 Rutherford Backscattering Spectrometry,RBS 476 9.2 Elastic Recoil Spectrometry,ERS488 93 Medium-Energy on Scattering with Channeling and Blocking,MEIS 502 9.4 Ion Scattering Spectroscopy,ISS 514 MASS AND OPTICAL SPECTROSCOPIES 10.0 Introduction 527 10.1 Dynamic Secondary Ion Mass Spectrometry,Dynamic SIMS 532 10.2 Static Secondary Ion Mass Spectrometry,Static SIMS 549 10.3 Surface Analysis by Laser lonization,SALI 559 10.4 Sputtered Neutral Mass Spectrometry,SNMS 57I 10.5 Laser Ionization Mass Spectrometry,LIMS 586 10.6 Spark Source Mass Spectrometry,SSMS 598 10.7 Glow-Discharge Mass Spectrometry,GDMS 609 10.8 Inductively Coupled Plasma Mass Spectrometry,ICPMS 624 10.9 Inductively Coupled Plasma-Optical Emission Spectroscopy,ICP-OES 633 NEUTRON AND NUCLEAR TECHNIQUES 11.0 Introduction 645 11.1 Neutron Diffraction 648 11.2 Neutron Reflectivity 660 11.3 Neutron Activation Analysis,NAA 67I 11.4 Nuclear Reaction Analysis,NRA 680 PHYSICAL AND MAGNETIC PROPERTIES 12.0 Introduction 695 12.1 Surface Roughness: ent,Form Sputtering.Impact on Depth Profiling 698 12.2 Optical Scatterometry 711 12.3 Magneto-Optic Kerr Rotation,MOKE 723 12.4 Phys sical and Chemical Adsorption Measurement of Solid Surface Areas 736 Index 745 Contents vil

ION SCATTERING TECHNIQUFS 9.0 Introduction 473 9.1 Rutherford Backscattering Spectrometry, RBS 476 9.2 Elastic Recoil Spectrometry, ERS 488 9.3 Medium-Energy Ion Scattering with Channeling and Blocking, MEIS 502 9.4 Ion scattering Spectroscopy, Iss 514 MASS AND OPTICAL SPECTROSCOPIES 10.0 10.1 10.2 10.3 10.4 10.5 10.6 10.7 10.8 10.9 Introduction 527 Dynamic Secondary Ion Mass Spectrometry, Dynamic SIMS Static Secondary Ion Mass Spectrometry, Static SIMS 549 Surfice Analysis by her Ionization, SAL1 Sputtered Neutral Mass Spectrometry, SNMS Laser Ionization Mass Spectrometry, LIMS Spark Source Mass Spectrometry, SSMS 598 Glow-Discharge Mass Spectrometry, GDMS 609 Inductively Coupled Plasma Mass Spectrometry, ICPMS Inductively Coupled Plasma-Optical Emission Spectroscopy, ICP-OES 633 532 559 586 571 624 NEUTRONANDNUCLEARTECHNIQUES 1'1.0 Introduction 645 1 1 .I Neutron Diffraction 648 11.2 Neutron Reflectivity 660 11.3 Neutron Activation Analysis, NAA 671 11.4 Nuclear Reaction Analysis, NRA 680 PHYSICAL AND MAGNETIC PROPERTIES 12.0 Introduction 695 12.1 Surface Roughness: Measurement, Formation by Sputtering, Impact on Depth Profiling 698 12.2 Optical Scatterometry 711 12.3 Magneto-optic Kerr Rotation, MOJSE 723 12.4 Physical and Chemical Adsorption Measurement of Solid Surface Areas 736 Contents vii

Preface to Series This Materials Series attempts to address the needs of the pract cal materials user,with an emphasis on the newer areas of surface,interface,and thin film microcharacterization.The Series is composed of the leading volume, Encyclopedia of Materials Characterization,and a set of about 10 subsequent vol- umes concentrating on characterization of individual materials classes In the fr lo 50 brief artices (cach 10-18 pages in length)ar n standard mat designed of rea acces technique descriptions and examples of their practical use.In addition to the arti- cles,there are one-page summaries for every technique,introductory summaries to groupings of related techniques,a complete glossary of acronyms,and a tabu- lar con parison of the major features of all 50 technic The 10 volumes in the Series on characterizatior of particular materials classes include silicon pro ing,me and alloys, materials integrated circuit packaging,etc.Characteri ation is approached from the mate- rials user's point of view.Thus,in general,the format is based on properties,pro- cessing steps,materials classification,etc.,rather than on a technique. The emphasis of all volumes is on surfaces,interfaces,and thin films,but the emphasis varies depending on the relative importance of these areas for the materials class cach olume reproduce the r one-page referred to that are not covered in the Encyclopedia The concept for the Series came from discussion with Marjan Bace of Manning Publications Company.A gap exists between the way materials characterization isofe presented and then eds of a large -the materials when,at the end of s or courses on analyt ques,a queston Is h material (or processing)characterization problem can be addressed the answer often is that the speaker is"an expert on the technique,not the materials aspects, and does not have experience with that particular situation."This Series is an attempt to bridge this gap by appmoaching characterization problems from the side of the o thank Marjan n from that of the analytical technic e for putting rd the pert Sha s and Yale Stra orig Wilson of Chi s Evans and A of Surfac ence Laboratories for help in further defining the Series,and the Ed tors of all th individual volumes for their efforts to produce practical,materials user based volumes. C.R Brundle C.A.Evans,Jr. ix

Preface to Series This Materialj Characterization Series attempts to address the needs of the practi￾cal materials user, with an emphasis on the newer areas of surfice, interface, and thin film microcharacterization. The Series is composed of the leading volume, Enychpedia of Materialj Characterization, and a set of about 10 subsequent vol￾umes concentrating on characterization of individual materials classes. In the Encyclopedia, 50 brief articles (each 10-18 pages in length) are presented in a standard format designed for ease of reader access, with straightforward technique descriptions and examples of their practical use. In addition to the arti￾cles, there are one-page summaries for every technique, introductory summaries to groupings of related techniques, a complete glossary of acronyms, and a tabu￾lar comparison of the major features of all 50 techniques. The 10 volumes in the Series on characterization of particular materials classes include volumes on silicon processing, metals and alloys, catalytic materials, integrated circuit packaging, etc. Characterization is approached from the mate￾rials user’s point of view. Thus, in general, the format is based on properties, pro￾cessing steps, materials classification, etc., rather than on a technique. The emphasis of all volumes is on surfaces, interfaces, and thin films, but the emphasis varies depending on the relative importance of these areas for the materials class concerned. Appendixes in each volume reproduce the relevant one-page summa￾ries from the Encyclopedia and provide longer summaries for any techniques referred to that are not covered in the Envcbpedia The concept for the Series came firom discussion with Marjan Bace of Manning Publications Comparly. A gap exists between the way materials characterization is often presented and the needs of a large segment of the audience-the materials user, process engineer, manager, or student. In our experience, when, at the end of talks or courses on analytical techniques, a question is asked on how a particular material (or processing) characterization problem can be addressed the answer often is that the speaker is “an expert on the technique, not the materials aspects, and does not have experience with that particular situation.” This Series is an attempt to bridge this gap by approaching characterization problems from the side of the materials user rather than from that of the analytical techniques expert. We would like to thank Marjan Bace for putting forward the original concept, Shaun Wilson of Charles Evans and Associates and Yale Strausser of Surface Sci￾ence Laboratories fbr help in hrther defining the Series, and the Editors of all the individual volumes for their efforts to produce practical, materials user based volumes. CR Brundle C.A. Evans,Jr. ix

Preface This volume contains 50 articles describing analytical techniques for the charac- terization of solid materials,with emphasis on surfaces,interfaces,thin films. and microanalytical approaches.It is part of the Materials Characterization Series copublished by Butterw rth-Heine nann and Manning.This volum rell as a c mpanion to the othe s in t characterization experts the articles are written to be casily accessible to the materials user,the process engineer,the manager,the student-in short to all those who are not (and probably don't intend to be)experts but who need to understand plications of the techni qu to materials problems.Too often tions are written for the ique spe cial organization of the book was difficult;certain technique could equally well have appeared in more than one place.The organizational intent of the Editors was to group techniques that have a similar physical basis,or that provide similar types of information.This is not the traditional organiza- tion of an wher e articles are ordered alphabetically.such ere,in par L se many the e multiple pos. sible acronym ns (ar Acronyms Glossary is pro d to help the reader The articles follow a standard format for each technique:A clear description of the technique,the range of information it provides,the range of materials to which it is applicable,a few typical examples,and some comparison to other related technic ques.Each technique has a ick referen on nary in Chapter paragraph and a tabular te broadly tha just t surfaces, interfaces,or thin films;for example X-Ray Diffraction and Infrared Spectros- copy,which have been used for half a century in bulk solid and liquid analysis, respectively.They are included here because they have by now been developed to also apply to surfaces.A few techniques that are applied alm nost entirely to bulk on Diffra tion)are i included give to ther meth use they are referred t ty the 10 materials volumes in the Series.Some techniques were left out because they were considered to be too restricted to specific applications or materials. We wish to thank all the many contributors for their efforts,and their patience and restraint in dealing with the Editors who took a fairly demanding approach to establishing the format,length,style,and content of the articles.We hope the readers will consider our efforts worthwhile.Finally,we would like to thank Lee professional help as Managing C.RBrundle CA.Evans.Ir.S.Wilson

This volume contains 50 articles describing analytical techniques for the charac￾terization of solid materials, with emphasis on surfaces, intedices, thin films, and microanalytical approaches. It is part of the Materzah Characterization Series, copublished by Buttenvorth-Heinemann and Manning. This volume can serve as a stand-alone reference as well as a companion to the other volumes in the Series which deal with individual materials classes. Though authored by professional characterization experts the articles are written to be easily accessible to the materials user, the process engineer, the manager, the student-in short to all those who are not (and probably don’t intend to be) experts but who need to understand the potential applications of the techniques to materials problems. Too often, technique descriptions are written for the technique specialist. With 50 articles, organization of the book was difficult; certain techniques could equally well have appeared in more than one place. The organizational intent of the Editors was to group techniques that have a similar physical basis, or that provide similar types of information. This is not the traditional organiza￾tion of an encyclopedia, where articles are ordered alphabetically. Such ordering seemed less useful here, in part because many of the techniques have multiple pos￾sible acronyms (an Acronym Glossavy is provided to help the reader). The articles follow a standard format for each technique: A clear description of the technique, the range of information it provides, the range of materials to which it is applicable, a few typical examples, and some comparison to other related techniques. Each technique has a “quick reference,” one-page summary in Chapter 1 , consisting of a descriptive paragraph and a tabular summary. Some of the techniques included apply more broadly than just to surhces, interhces, or thin films; for example X-Ray Diffraction and Infrared Spectros￾copy, which have been used for half a century in bulk solid and liquid analysis, respectively. They are included here because they have by now been developed to also apply to surfaces. A fay techniques that are applied almost entirely to bulk materials (e.g., Neutron Diffraction) are included because they give complemen￾tary information to other methods or because they are referred to significantly in the 10 materials volumes in the Series. Some techniques were left out because they were considered to be too restricted to specific applications or materials. We wish to thank all the many contributors for their efforts, and their patience and restraint in dealing with the Editors who took a hirly demanding approach to establishing the format, length, style, and content of the articles. We hope the readers will consider our efforts worthwhile. Finally, we would like to thank Lee Fitzpatrick of Manning Publications Co. for her professional help as Managing Editor. C. R. Brund. CA. Evans, /r. S. Mhon

Acronyms Glossary This glossary lists all the acronyms referred to in the encyclopedia together with their ayosed phabetically.Altc of these entries acronyms (variations or subsets of techniques;terminology used within the technique area)are grouped together below the major acronym and indented to the right.Most,but not all,of the techniques listed here are the subject of individual articles in this volume. sorption Spectroscopy VPD-AAS omposition-Atomic Absorption Spectroscopy GFAA Atomi FAA AES Auger Electron Spectroscopy Auger Electron S ectroscopy Scanning Auger Microscopy Scanning Auger Microprobe AED Auger Electron Diffraction Angular Distribution Auger Microscopy rror Analyzer AIS Atom Inelastic Scattering BET Brunauer,Emmett,and Teller equation BSDE Bidirectional sca BRDE n Fu BTDF Bidirectional Transmission Distribution Functior CL Cathodluminescence CLSM Confocal Scanning Laser Microscope EDS Energy Dispersive(X-Ray)Spectroscopy ED》 Energy Dispersive X-Ray Spectroscopy EDAX Company selling EDX equipment EELS Electron Energy Loss Spectroscopy High-Resolution Electron Energy-Loss Spectroscopy -Energy Electron-Los Spectroscopy

Acronyms Glossary This glossary lists all the acronyms referred to in the encyclopedia together with their meanings. The major technique acronyms are listed alphabetically. Alter￾natives to these acronyms are listed immediately below each of these entries, if they exist. Related acronyms (variations or subsets of techniques; terminology used within the technique area) are grouped together below the major acronym and indented to the right. Most, but not all, of the techniques listed here are the subject of individual articles in this volume. AAS AA VPD-AAS GFAA FAA AES Auger SAM SAM AED ADAM K.E CMA AIS BET BSDF BRDF BTDF CL CLSM EDS EDX EDAX EELS HEELS REELS REELM EELS Atomic Absorption Spectroscopy Atomic Absorption Vapor Phase Decomposition-Atomic Absorption Spectroscopy Graphite Furnace Atomic Absorption Flame Atomic Absorption Auger Electron Spectroscopy Auger Electron Spectroscopy Scanning Auger Microscopy Scanning Auger Microprobe Auger Electron Diffraction Angular Distribution Auger Microscopy Kinetic Energy Cylindrical Mirror Analyzer Atom Inelastic Scattering Brunauer, Emmett, and Teller equation Bidirectional Scattering Distribution Function Bidirectional Reflective Distribution Function Bidirectional Transmission Distribution Function Cathodluminescence Confocal Scanning Laser Microscope Energy Dispersive (X-Ray) Spectroscopy Energy Dispersive X-Ray Spectroscopy Company selling EDX equipment Electron Energy Loss Spectroscopy High-Resolution Electron Energy-Loss Spectroscopy Reflected Electron Energy-Loss Spectroscopy Reflection Electron Energy-Loss Microscopy Low-Energy Electron-Loss Spectroscopy xi

PEELS Parallel(Detection)Electron Energy-Loss Spectrscopy EXELFS Extended Energy-Loss Fine Structure EELFS Electron Energy-Loss Fine Structure nEbgpmon EPMA Electron Probe microanalysis Electron Probe Electron Probe Microanalysis ERS Elastic Recoil Spec ometry HFS Hydrogen Forward Scatter ing HRS Hydro FRS Forward Reooil Sp ERDA Elastic recoil de ERD Elastic recoil detection PRD Particle Recoil Detection EXAES Extended X-Ray Abs SEXAFS Surface Extended X-Ray Abs NEXAFS Near-Edge X-Ray Ab otion fi XANES X-Ray Ab XAFS tion Fine Stru FMR Ferromagnetic Resonance FTIR See IR FTRaman See Raman HREELS See EELS HRTEM SeeTEM GDMS arge GDQMS 8 ectrometry using Gloquad asma Mass Spectrometry ICP-MS sma asma Optical Emissior IETS Inelastic Electron Tunneling Spectroscopy Infrared(Spectroscopy) FTIR Fourier Transform Infra-Red(Spectroscopy Gas Chromatography FTIR Thermo xii Acronyms Glossary

PEELS EXELFS EELFS CEELS VEELS EPMA Electron Probe ERS HFS HRS FRS ERDA ERD PRD EXAFS SEXAFS NEXAFS XANES XAFS FMR FTIR FT Raman HREELS HRTEM GDMS GDQMS Gloquad ICP-MS ICP LA-ICP-MS ICP-Optical ICP IETS IR FTIR GC-FTIR TGA-FTIR ATR Parallel (Detection) Electron Energy-Loss Spectrscopy Extended Energy-Loss Fine Structure Electron Energy-Loss Fine Structure Core Electron Energy-Loss Spectroscopy Valence Electron Energy-Loss Spectroscopy Electron Probe Microanalysis Electron Probe Microanalysis Elastic Recoil Spectrometry Hydrogen Forward Scattering Hydrogen Recoil Spectrometry Forward Recoil Spectrometry Elastic Recoil Detection Analysis Elastic Recoil Detection Particle Recoil Detection Extended X-Ray Absorption Fine Structure Surface Extended X-Ray Absorption Fine Structure Near-Edge X-Ray Absorption Fine Structure X-Ray Absorption Near-Edge Structure X-Ray Absorption Fine Structure Ferromagnetic Resonance See IR See Raman See EELS See TEM Glow Discharge Mass Spectrometry Glow Discharge Mass Spectrometry using a Quadruple Mass Analyser Manufacturer name Inductively Coupled Plasma Mass Spectrometry Inductively Coupled Plasma Laser Ablation ICP-MS Inductively Coupled Plasma Optical Emission Inductively Coupled Plasma Inelastic Electron Tunneling Spectroscopy Infrared (Spectroscopy) Fourier Transform Infra-Red (Spectroscopy) Gas Chromatography FTIR Thermo Gravimetric Analysis FTIR Artenuated Total Reflection xii Acronyms Glossary

RA Reflection Absorption(Spectroscopy) IRAS Infrared Reflection Absorption Spectroscopy ISS LEIS RCE Low-Energ Ch arge Exchange LEED Low-Energy Electron Diffraction LIMS Laser Ionization Mass Spectrometry LAMMA Laser Microprobe Mass Analysis Laser Microprobe Mass Spectrometry Laser lonization Mass Analysis NRMP Nonresonant Multi-Photon Ionization MEISS Medium-Energy Ion Scattering Spectrometry MEIS Medium-Energy Ion Scattering MOKE SMOKE neto-Optic Kerr Rotation NAA INAA on Fine Structure NIS Neutron Inelastic Scattering NMR Nuclear Magnetic Resonance MAS Magic-Angle Spinning NrA Nuclear Reaction Analysis OES Optical Emission Spectroscopy PAS Photoacoustic Spectroscopy PIXE Particle Induced X-Ray Emission HIXE Hydrogen/Helium Induced X-ray Emission PL Photoluminescence PLE Photoluminescence Excitation PR EBER RDS Reflection Difference Spectroscopy FTRaman Raman Spectroscopy RS Raman scatterin RRS Res onant Raman Scattering CARS Coherent Anti-Stokes Raman Scattering Acronyms Glossary xiil

RA IRAS ISS LEIS RCE LEED LIMS LAMMA LAMMS LIMA NRMPI MEISS MEIS MOKE SMOKE NAA INAA NEXAFS XANES NIS NMR MAS NRA OES PAS PIXE HIXE PL PLE PR EBER RDS Raman FT Raman RS RRS CARS Reflection Absorption (Spectroscopy) Infrared Reflection Absorption Spectroscopy Ion Scattering Spectrometry Low-Energy Ion Scattering Resonance Charge Exchange Low-Energy Electron Diffraction Laser Ionization Mass Spectrometry Laser Microprobe Mass Analysis Laser Microprobe Mass Spectrometry Laser Ionization Mass Analysis Nonresonant Multi-Photon Ionization Medium-Energy Ion Scattering Spectrometry Medium-Energy Ion Scattering Magneto-optic Kerr Rotation Surface Magneto-optic Kerr Rotation Neutron Activation Analysis Instrumental Neutron Activation Analysis Near Edge X-Ray Absorption Fine Structure X-Ray Absorption Near Edge Structure Neutron Inelastic Scattering Nuclear Magnetic Resonance Magic-Angle Spinning Nuclear Reaction Analysis Optical Emission Spectroscopy Photoacoustic Spectroscopy Particle Induced X-Ray Emission Hydrogen/Helium Induced X-ray Emission Photoluminescence Photoluminescence Excitation Photoreflectance Electron Beam Electroreflectance Reflection Difference Spectroscopy Raman Spectroscopy Fourier Transform Raman Spectroscopy Raman Scattering Resonant Raman Scattering Coherent Anti-Stokes Raman Scattering Acronyms Glossary xiii