《电子工程师手册》学习资料(英文版)Electronics

Steadman, J W."Section III- Electronics The Electrical Engineering Handbook Ed. Richard C. Dorf Boca Raton CRC Press llc. 2000
Steadman, J.W. “Section III – Electronics” The Electrical Engineering Handbook Ed. Richard C. Dorf Boca Raton: CRC Press LLC, 2000

The Cheetah disc drive is produced by Seagate Technology, Scotts Valley, California, and has been dubbed the industry's fastest disc drive. The Cheetah is the worlds first-announced drive to utilize 10,000-rpm technology The increased rotational remarkably increases data transfer rates to 15 Mbytes/ sec which is 40% greater than that f 7, 200-rpm drives. The 10,000-rpm rotational rate also significantly reduces the seek time Seagate's pioneering of the 10,000-rpm technology enables OEMs, VARs, and system integrators to take advan tage of performance levels that were previously unattainable. Seagate has developed and manufactured some of the industry's highest-performance disc drives which not only enable users to achieve higher levels of system performance, but will also introduce exciting new electronic applications. ( Photo courtesy of Seagate Technology c 2000 by CRC Press LLC
The Cheetah disc drive is produced by Seagate Technology, Scotts Valley, California, and has been dubbed the industry’s fastest disc drive. The Cheetah is the world’s first-announced drive to utilize 10,000-rpm technology. The increased rotational remarkably increases data transfer rates to 15 Mbytes/sec which is 40% greater than that of 7,200-rpm drives. The 10,000-rpm rotational rate also significantly reduces the seek time. Seagate’s pioneering of the 10,000-rpm technology enables OEMs, VARs, and system integrators to take advantage of performance levels that were previously unattainable. Seagate has developed and manufactured some of the industry’s highest-performance disc drives which not only enable users to achieve higher levels of system performance, but will also introduce exciting new electronic applications. (Photo courtesy of Seagate Technology.) © 2000 by CRC Press LLC

Electronics 22 Semiconductors G.S. Gildenblat, B Elmont, M. Milkovic A Elshabini-Riad F.W. Stephenson, L.A. Bhutta, D. C. Look Physical Properties. Diodes. Electrical Equivalent Circuit Models and Device Simulators for emiconductor Devices Electrical Characterization of Semiconductors 23 Semiconductor Manufacturing H.G. Parks, W. Needham, S Rajaram, C. Raffer 8 Processes. Testing.Electrical Characterization of Interconnections. Process M Simulation 24 Transistors S. Soclof, J. Watson, J.R. Brews Junction Field-Effect Transistors. Bipolar Transistors. The Metal-Oxide Semiconductor Field Effect Transistor(MOSFET) 25 Integrated Circuits J.E. Brewer, M.R. Zargham, S. Tragoudas, S. Tewksbury Integrated Circuit Technology. Layout, Placement, and Routing. Application-Specific Integrated G.R. Blackwell SMT Design, Assembly, and Test Overview. Surface Mount Device ubstrate Design Guidelines. Thermal Design Considerations Adhesives·Sold oint Formation Parts Inspection and Placement. Reflow Soldering. Cleaning. Prototype Systems 27 Operational amplifiers E. Kennedy j v wait Ideal and Practical Models. Applications 8 Amplifiers G.L. Carpenter, J. Choma, J. Large Signal Anal 9 Active Filters R.E. Massara, W. Steadman, B M. Wilamowski, J.A. Svoboda Synthesis of Low-Pass Forms. Realization. Generalized Impedance Converters and Simulated 30 Power Electronics K Rajashekara, A.K.S. Bhat, ry ons jies.Converter Control of Power Semiconductor Devices. Power Conversion. Power Supp 31 Optoelectronics J. Hecht, L.S. Watkins, R.A. Becker Lasers· Sources and detectors· Circuits 32 D/A and A/D Converters S.A.R. garrod 33 Thermal Management of Electronics A Bar-Cohen Heat Transfer Fundamentals Chip module Thermal Resistance 34 Digital and Analog Electronic Design Automation A. Dewey Design Entry. Synthesis. Verification. Physical Design. Test c 2000 by CRC Press LLC
© 2000 by CRC Press LLC III Electronics 22 Semiconductors G.S. Gildenblat, B. Gelmont, M. Milkovic, A. Elshabini-Riad, F.W. Stephenson, I.A. Bhutta, D.C. Look Physical Properties • Diodes • Electrical Equivalent Circuit Models and Device Simulators for Semiconductor Devices • Electrical Characterization of Semiconductors 23 Semiconductor Manufacturing H.G. Parks, W. Needham, S. Rajaram, C. Rafferty Processes • Testing • Electrical Characterization of Interconnections • Process Modeling and Simulation 24 Transistors S. Soclof, J. Watson, J.R. Brews Junction Field-Effect Transistors • Bipolar Transistors • The Metal-Oxide Semiconductor FieldEffect Transistor (MOSFET) 25 Integrated Circuits J.E. Brewer, M.R. Zargham, S. Tragoudas, S. Tewksbury Integrated Circuit Technology • Layout, Placement, and Routing • Application-Specific Integrated Circuits 26 Surface Mount Technology G.R. Blackwell Definition and Considerations • SMT Design, Assembly, and Test Overview • Surface Mount Device (SMD) Definitions • Substrate Design Guidelines • Thermal Design Considerations • Adhesives • Solder Paste and Joint Formation • Parts Inspection and Placement • Reflow Soldering • Cleaning • Prototype Systems 27 Operational Amplifiers E.J. Kennedy, J.V. Wait Ideal and Practical Models • Applications 28 Amplifiers G.L. Carpenter, J. Choma, Jr. Large Signal Analysis • Small Signal Analysis 29 Active Filters R.E. Massara, J.W. Steadman, B.M. Wilamowski, J.A. Svoboda Synthesis of Low-Pass Forms • Realization • Generalized Impedance Converters and Simulated Impedances 30 Power Electronics K. Rajashekara, A.K.S. Bhat, B.K. Bose Power Semiconductor Devices • Power Conversion • Power Supplies • Converter Control of Machines 31 Optoelectronics J. Hecht, L.S. Watkins, R.A. Becker Lasers • Sources and Detectors • Circuits 32 D/A and A/D Converters S.A.R. Garrod D/A and A/D Circuits 33 Thermal Management of Electronics A. Bar-Cohen Heat Transfer Fundamentals • Chip Module Thermal Resistance 34 Digital and Analog Electronic Design Automation A. Dewey Design Entry • Synthesis • Verification • Physical Design • Test

John W. steadman University of wyoming HE TRULY INCREDIBLE CHANGES in the technology associated with electronics over the past three decades have certainly been the driving force for most of the growth in the field of electrical engineering Recall that 30 years ago the transistor was a novel device and that the majority of electronic systems still used vacuum tubes. Then look at the section headings in the following chapters and appreciate the range of ways that electronics has impacted electrical engineering. Amplifiers, integrated circuits, filters, power electronics, and optoelectronics are examples of how electronics transformed the practice of electrical engi neering in such diverse fields as power generation and distribution, communications, signal processing, and The various contributors to this section have done an outstanding job of providing concise and practical overage of this immense field. By necessity, the content ranges from rather theoretical considerations, such as physical principles of semiconductors, to quite practical issues such as printed circuit board technology and circuits for active filter realizations. There are areas of overlap with other chapters in the Handbook, such as those covering electrical effects and devices, biomedical electronics, digital devices, and computers. The con tributors to this section, however, have maintained a focus on providing practical and useful information directly related to electronics as needed by a practicing electrical engineer. The author(s)of each chapter was given the task of providing broad coverage of the field while being restricted to only a few pages of text. As a result, the information content is quite high and tends to treat the main principles or most useful topics in each area without giving the details or extensions of the subject. This practice, followed throughout the Handbook, is what makes it a valuable new work in electrical engineering. In most cases the information here will be complete enough. When this is not the case, the references will point the ray to whatever added information is necessary. Nomenclature Unit Symbo area mall-signal current gain A current gain n quantum efficiency incremental base current A ionization coefficient lumen/cm B bandwidth lB direct base current 2998×10m/sI diode forward current A direct emitter current C pecific heat /kg K reverse saturation coupling capacitor CE emitter bypass capacitor J current density A/m2 unction capacitance k Boltzmann constant 1.38 x J/K ∈。 permittivity constant8.85×102F/mk wave vector focal lengt luminous flux thermal conductivity W/m K 入 pn-Junction contact 入 magnetic permeability H/m μ kg/ms Plancks constant 6.626×103Js electron mobility h heat transfer coefficient unnv electron density electrons/cm3 current gain light frequenc
© 2000 by CRC Press LLC John W. Steadman University of Wyoming HE TRULY INCREDIBLE CHANGES in the technology associated with electronics over the past three decades have certainly been the driving force for most of the growth in the field of electrical engineering. Recall that 30 years ago the transistor was a novel device and that the majority of electronic systems still used vacuum tubes. Then look at the section headings in the following chapters and appreciate the range of ways that electronics has impacted electrical engineering. Amplifiers, integrated circuits, filters, power electronics, and optoelectronics are examples of how electronics transformed the practice of electrical engineering in such diverse fields as power generation and distribution, communications, signal processing, and computers. The various contributors to this section have done an outstanding job of providing concise and practical coverage of this immense field. By necessity, the content ranges from rather theoretical considerations, such as physical principles of semiconductors, to quite practical issues such as printed circuit board technology and circuits for active filter realizations. There are areas of overlap with other chapters in the Handbook, such as those covering electrical effects and devices, biomedical electronics, digital devices, and computers. The contributors to this section, however, have maintained a focus on providing practical and useful information directly related to electronics as needed by a practicing electrical engineer. The author(s) of each chapter was given the task of providing broad coverage of the field while being restricted to only a few pages of text. As a result, the information content is quite high and tends to treat the main principles or most useful topics in each area without giving the details or extensions of the subject. This practice, followed throughout the Handbook, is what makes it a valuable new work in electrical engineering. In most cases the information here will be complete enough. When this is not the case, the references will point the way to whatever added information is necessary. Nomenclature Symbol Quantity Unit A area m2 Ai current gain Av terminal voltage gain ai ionization coefficient B bandwidth Hz C velocity of light in 2.998 ¥ 108 m/s vacuum C specific heat W/kg K Cc coupling capacitor CE emitter bypass capacitor Cj junction capacitance F E energy J eo permittivity constant 8.85 ¥ 10–12 F/m f focal length m F luminous flux lumen F radiational factor f pn-junction contact V potential gm transconductance S h Planck’s constant 6.626 ¥ 10–34 J·s h heat transfer coefficient hFE common-emitter direct current gain Symbol Quantity Unit hre small-signal current gain h quantum efficiency ib incremental base current A I illuminance lumen/cm IB direct base current A ID diode forward current A IE direct emitter current A Is reverse saturation A current J current density A/m2 k Boltzmann constant 1.38 ¥ 10–23 J/K k wavenumber rad/m k wave vector k attenuation k thermal conductivity W/m K l carrier mean free path m l wavelength m m magnetic permeability H/m m viscosity kg/ms mn electron mobility n electron density electrons/cm3 n refractive index n light frequency Hz T

hole density holes/ absolute temperature K Prandtl number 严Tt momentum relaxation Bloch wave function time electronic charge 1.6×10-19C volumetric flow rate m/s q heat flow vVvvvwZ electron velocity base resisto direct base-emitter BRRR eynolds number generator internal direct voltage supply mv total resistance Zener voltage Stefan-Boltzmann 5.67×10 characteristic impedance Q2 W/m2 K
© 2000 by CRC Press LLC Symbol Quantity Unit p hole density holes/cm3 Pr Prandtl number ybk Bloch wave function q electronic charge 1.6 ¥ 10–19 C q heat flow W RB base resistor Re Reynolds number Rg generator internal W resistance RG total resistance W s conductivity S s Stefan-Boltzmann 5.67 ¥ 10–8 constant W/m2 K4 Symbol Quantity Unit T absolute temperature K t momentum relaxation s time q volumetric flow rate m3 /s v electron velocity m/s VBE direct base-emitter V voltage VCC direct voltage supply V VT thermal voltage mV VZ Zener voltage V W power W Zo characteristic impedance W
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